A One Day Seminar
This seminar covers digital system signal integrity
principles and measurement of high speed VLSI packages, printed wiring
boards, backplanes, cables connectors and other interconnect components.
The course shows how the use of a TDR digital oscilloscope, such as the H-P
54120, can determine impedance profiles (ordinary and differential), time
domain transmission properties and crosstalk properties of printed circuit
boards and high speed interconnects. Packaging and fixturing effects on
device characterization will be discussed as well.
To provide state-of-the-art theory, and measurement
techniques of digital system signal integrity engineering as they affect
system performance, system design, simulation and manufactured costs.
Application of course materials will result in lower risk designs and
manufactured costs of interconnect and PCB components. Discussion of
participant designs is expected.
Who Should Attend:
- Engineers designing
high performance digital systems (FutureBus , ECL and fast CMOS),
video and cache memory, processor and computer system test engineers.
- Bus and backplane
architects and designers. Semiconductor packaging and interconnect
characterization and component engineers.
- Fine line and SMT
printed circuit layout, manufacturing and printed circuit board
designers and QC test engineers and technicians.
- Review of classical
transmission line impedance, propagation delay and crosstalk. Theory
will be applied to printed circuit board impedance, propagation delay
and crosstalk measurement and prediction tools.
- Introduction to Time
Domain Signal Integrity measurements and test case design. TDR theory
- ordinary and differential, Time Domain Transmission (TDT's) and
Crosstalk theory and measurements will be covered.
- Principles and test
case design for the TDR, TDT and crosstalk characterization of VLSI
semiconductor packaging. An example of a SPICE simulation of a VLSI
PGA package is given.
- Signal Integrity CAD
system design rule and specification. Electromagnetic Interference
(EMI) resistant design principles for VDE and CISPR emissions
compliance of high speed digital systems.