A Three Day Seminar
This seminar provides a comprehensive educational
experience in the principles of signal integrity engineering as it applies
to semiconductor packaging, printed wiring board, cable and connector
electrical performance. Time domain transmission line theory will be
discussed, including reflections, signal transmission, bus termination
techniques and crosstalk in PC boards and discrete elements. The seminar
will also cover an introduction to crosstalk theory in transmission lines
and coupled discrete elements. analysis and testing of semiconductor
packages, cables, connectors and printed wiring boards. SPICE simulation of
test articles will be detailed to show the verification of the testing
demonstrating the validity of the electrical element values extracted from
the measurement data. Lastly, CAD based issues will be discussed. Following
the lecture portion of the seminar, students will participate in a
discussion session covering design topics of interest in the current high speed
To provide state-of-the-art signal integrity theory and
measurement techniques for semiconductor packaging, printed wiring board,
cable and connectors as they relate to the design of digital systems. Application
of course material will result in lower risk designs and manufactured costs
Who Should Attend:
application engineers, logic designers and architects designing and
testing high performance digital systems. Bus and backplane architects
packaging and interconnect characterization and component engineers.
- Fine line and SMT
printed circuit layout, manufacturing and printed circuit board
designers, quality control test engineers and technicians.
Day 1 - Part 1: Introduction and Overview
of Interconnect Technology:
Review of current VLSI semiconductor packaging designs
and applications including electrical signal considerations - PGA vs. SMT,
materials and internal construction.
Review of current state-of-the-art in Printed Wiring Boards and
backplanes including materials, construction methods, electrical and signal
Review of backplane connectors including materials, construction
methods, electrical and signal considerations. Topics will include the
FutureBus+ and HD+ family of connectors impedance, transmission and
Review of the principles of high performance cables including materials,
construction methods, electrical and signal considerations. Topics will
include cable and connector impedance, transmission and crosstalk
Day 2 - Part 1: Principles of Signal
Review of Transmission Line Theory
- Resistive and
- Lumped parasitic
elements in a transmission line environment
- Lossy lines
- On-chip metalization
as a transmission line medium
- Electrical scaling
laws for distributed and lumped constant systems - theory vs.
Analysis of distributed and discrete crosstalk
- Properties of
crosstalk characterization and crosstalk coefficients
- Scaling laws for
- Common mode
crosstalk and simultaneous switching analysis
Review of pertinent semi-conductor theory,
technologies and principles.
- Bi-polar ECL and
CMOS SPICE device models. Emphasis will be on devices designed for Bus
Circuit theory analysis of a simple point to point
- Introduction to SPICE
simulation of digital interconnect circuitry
- Bus loading and fan
Bypass and bulk storage problems in high speed design
involving fast edge rate Bi-polar, Bi-CMOS and CMOS designs.
Day 2 - Part 2: Printed Circuit Impedance
and Propagation Delay Prediction Models:
Classical formulas for impedance and propagation delay.
Limitation in the use of these formulas.
Overview of numerical methods of field theory to predict capacitance
inductance, impedance, propagation delay and crosstalk in coupled signal
Discussion of the effects of material dimensions and homogeneity,
dielectric constant, line dimensions in printed wiring board design. Losses
in interconnect systems.
Day 3 - Part 1: Introduction to Time Domain
Reflectometry, Transmission and Crosstalk Testing:
Printed wiring board measurement of impedance,
propagation delay, risetime bandwidth, forward and backward crosstalk.
Differential impedance theory and experimental measurements. Test
objects include printed wiring board and cable assemblies.
Design of printed wiring board, connector and cable evaluation
technology evaluation test cases.
Day 3 - Part 2: Detailed Analysis of
Semi-Conductor Package Using Time Domain Measurements:
Construction of typical semiconductor packages
Test case design for the characterization of a semiconductor package
Discussion of the impedance, transmission and crosstalk measurements
Simulation of simultaneous switching effects
Analysis of package measurements to extract equivalent circuit elements
SPICE simulation of direct package path. Comparison of simulations and
Day 3 - Part 3: EMI Effects in Digital
The role of signal integrity in improving EMI performance
Design principles for power distribution, cable termination, etc.
EMI testing review - FCC, VDE compliance
Day 3 - Part 4: Summary and Open Class
Design rule development for signal integrity in the CAD
Real life bus topologies - FutureBus+, multi-drop stub lengths
controlled risetime drivers, connector crosstalk effects.
Correlation of TDR, TDT and crosstalk measurements to reality